Dip Coater Programmable Substrate Dip Withdrawal Coating Machine Sol-gel Process Multi-layer Dip Wafer Coating System

Product Application
The dip-coating machine is primarily used to prepare thin-film materials via liquid-phase methods, such as the sol-gel process. A clean, dry substrate is immersed in a solution (sol) and then vertically withdrawn at a preset speed. This process deposits a layer known as a "wet gel film" onto the substrate; as the solvent evaporates from this layer, it solidifies into a "dry gel film." Subsequent drying and high-temperature heat treatment transform the dry gel film into the desired nanomaterial thin film. Film thickness is determined by the withdrawal speed, liquid concentration, and liquid viscosity.

Product Overview
This dip-coating machine is specifically designed for research into thin-film preparation via liquid-phase methods (particularly the sol-gel process), enabling film growth on various substrates through dip-coating. Parameters such as withdrawal speed, withdrawal height, immersion time, number of coating cycles (for multi-layer deposition), and intervals between coatings are continuously adjustable and precisely controlled. There are no special requirements for the substrate; coating can be applied to sheet, block, or cylindrical shapes. The system operates stably with no vibration at the liquid surface, significantly enhancing experimental precision and efficiency.

It is suitable for coating the surfaces of various solid materials, including silicon wafers, crystal wafers, glass, ceramics, and metals, and is applicable to both scientific research and industrial production.